Damage-free polishing of SiC by Slurryless Electrochemical Mechanical Polishing

Chemical Mechanical Polishing by Colloidal Silica Slurry

Chemical Mechanical Polishing is a unique process enabling technology that allows chip makers to readily drive lithographic patterning steps to smaller dimensions, an ages old, “retro” technology related to glass polishing and metallographic finishing, thus enabling optical lithography to work. It represents a situation that is a true paradigm shift from the typical way in which technological a...

Electrochemical Polishing of Patterned Copper Films

For decades Electrochemical Polishing (ECP) has been used for surface polishing of bulk metal materials such as copper and stainless steel. However, it was found very challenging to planarize patterned copper films electrodeposited on silicon wafers. This work studied the mechanisms of ECP, the surface profiles and ECP effects of copper bulk and films in various electrolyte solutions. Satisfied...

Chemical mechanical polishing of thin film diamond

The demonstration that Nanocrystalline Diamond (NCD) can retain the superior Young’s modulus (1100 GPa) of single crystal diamond twinned with its ability to be grown at low temperatures (<450 C) has driven a revival into the growth and applications of NCD thin films. However, owing to the competitive growth of crystals the resulting film has a roughness that evolves with film thickness, preven...

Axiomatic System Design : Chemical Mechanical Polishing

Axiomatic design is investigated as a design methodology for large or complex system design. Particular considerations of system design are described and the suitability of axiomatic design for such considerations is discussed. Then, tools to enable successful application of axiomatic design to systems are developed. The tools are expressed as theorems for axiomatic system design. The first the...

Laser Assisted Chemical Mechanical Polishing for Planarization